Current position:
Zeiss Gemini300 / 3View XP
Release date: 2019-05-30
SEM: Zeiss Gemini300 / 3View XP Electron source: Thermal field emission (0.02 – 30 kV) Brightness: 3 pA – 20 nA Lateral resolution: >1.4 nm (1kV) Cutting thickness: >15 nm Detector1: Angular selective backscattered detector/ Dectector2: Secondary electron detector 3D Electron Microscopy Imaging System (Zeiss Gemini300 / 3View XP): The super-quick high-resolution 3D imaging system is based on a field emission scanning electron microscope (ZEISS Gemini 300) equipped with an in-chamber ultramicrotome (Gatan 3View XP). That allows acquiring high-resolution 3D data from resin-embedded cell and tissue samples in the shortest possible time and the most convenient way. The sample is continuously cut with nm precision using a diamond knife and the block-face is imaged with annular backscatter electron detector (aBSE detector) so one can produce thousands of serial images in a single day. The system achieves a lateral resolution of 1.4 nm at 1kV and a cutting thickness (axial resolution) up to 15 nm. In addition, a focal charge compensation system is implemented to eliminate charging from tissue samples with low conductivity, such as lung, liver, kidney and cochlea.
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