Current position:
Zeiss Gemini300 / 3View XP
Release date:  2019-05-30

SEM: Zeiss Gemini300 / 3View XP
Electron source:  Thermal field emission (0.02 – 30 kV)
Brightness:  3 pA – 20 nA
Lateral resolution: >1.4 nm (1kV)
Cutting thickness: >15 nm
Detector1:  Angular selective backscattered detector/
Dectector2:  Secondary electron detector

3D Electron Microscopy Imaging System (Zeiss Gemini300 / 3View XP):
The super-quick high-resolution 3D imaging system is based on a field emission scanning electron microscope (ZEISS Gemini 300) equipped with an in-chamber ultramicrotome (Gatan 3View XP). That allows acquiring high-resolution 3D data from resin-embedded cell and tissue samples in the shortest possible time and the most convenient way. The sample is continuously cut with nm precision using a diamond knife and the block-face is imaged with annular backscatter electron detector (aBSE detector) so one can produce thousands of serial images in a single day. The system achieves a lateral resolution of 1.4 nm at 1kV and a cutting thickness (axial resolution) up to 15 nm. In addition, a focal charge compensation system is implemented to eliminate charging from tissue samples with low conductivity, such as lung, liver, kidney and cochlea.


2019-03-28三维电子显微成像系统1.jpg